Professional Certificate in Semiconductor Failure Analysis for Manufacturing
-- ViewingNowThe Professional Certificate in Semiconductor Failure Analysis for Manufacturing is a comprehensive course designed to equip learners with the essential skills needed to excel in the semiconductor industry. This course is crucial in a time when the demand for semiconductor devices is at an all-time high, and the need for skilled professionals in failure analysis is more important than ever.
5,802+
Students enrolled
GBP £ 140
GBP £ 202
Save 44% with our special offer
ě´ ęłźě ě ëí´
100% ě¨ëźě¸
ě´ëěë íěľ
ęłľě ę°ëĽí ě¸ěŚě
LinkedIn íëĄíě ěśę°
ěëŁęšě§ 2ę°ě
죟 2-3ěę°
ě¸ě ë ěě
ë기 ę¸°ę° ěě
ęłźě ě¸ëśěŹí
⢠Fundamentals of Semiconductor Failure Analysis: An introductory unit covering the basics of semiconductor failure analysis, including common failure modes, analysis techniques, and industry standards.
⢠Semiconductor Fabrication Processes: A unit focusing on the various stages of semiconductor fabrication, including photolithography, etching, deposition, and implantation. Understanding these processes is crucial for identifying potential failure points.
⢠Testing and Characterization Techniques: This unit covers the various testing and characterization techniques used to assess semiconductor devices, including electrical, optical, and thermal testing methods.
⢠Imaging and Microscopy Techniques: An in-depth look at imaging and microscopy techniques used in semiconductor failure analysis, including scanning electron microscopy (SEM), transmission electron microscopy (TEM), and optical microscopy.
⢠Failure Analysis Tools and Equipment: A unit covering the various tools and equipment used in semiconductor failure analysis, including probe stations, curve tracers, and X-ray systems.
⢠Fault Isolation Techniques: This unit focuses on techniques used to isolate and identify the root cause of semiconductor failures, including electrical and physical fault isolation methods.
⢠Reliability Engineering and Physics of Failure: A unit covering the principles of reliability engineering and the physics of failure, including accelerated testing and failure mechanism identification.
⢠Data Analysis and Report Writing: This unit covers the critical importance of data analysis and report writing in semiconductor failure analysis, including data interpretation, statistical analysis, and report writing best practices.
⢠Case Studies in Semiconductor Failure Analysis: A unit consisting of real-world case studies in semiconductor failure analysis, providing practical examples of the concepts covered in the previous units.
ę˛˝ë Ľ 경ëĄ
ě í ěęą´
- 죟ě ě ëí 기본 ě´í´
- ěě´ ě¸ě´ ëĽěë
- ěť´í¨í° ë° ě¸í°ëˇ ě ꡟ
- 기본 ěť´í¨í° 기ě
- ęłźě ěëŁě ëí íě
ěŹě ęłľě ěę˛Šě´ íěíě§ ěěľëë¤. ě ꡟěąě ěí´ ě¤ęłë ęłźě .
ęłźě ěí
ě´ ęłźě ě ę˛˝ë Ľ ę°ë°ě ěí ě¤ěŠě ě¸ ě§ěęłź 기ě ě ě ęłľíŠëë¤. ꡸ę˛ě:
- ě¸ě ë°ě 기ę´ě ěí´ ě¸ěŚëě§ ěě
- ęśíě´ ěë 기ę´ě ěí´ ęˇě ëě§ ěě
- ęłľě ě겊ě ëł´ěě
ęłźě ě ěąęłľě ěźëĄ ěëŁí늴 ěëŁ ě¸ěŚě뼟 ë°ę˛ ëŠëë¤.
ě ěŹëë¤ě´ ę˛˝ë Ľě ěí´ ě°ëŚŹëĽź ě ííëę°
댏롰 ëĄëŠ ě¤...
ě죟 돝ë ě§ëŹ¸
ě˝ě¤ ěę°ëŁ
- 죟 3-4ěę°
- 쥰기 ě¸ěŚě ë°°ěĄ
- ę°ë°Ší ëąëĄ - ě¸ě ë ě§ ěě
- 죟 2-3ěę°
- ě 기 ě¸ěŚě ë°°ěĄ
- ę°ë°Ší ëąëĄ - ě¸ě ë ě§ ěě
- ě 체 ě˝ě¤ ě ꡟ
- ëě§í¸ ě¸ěŚě
- ě˝ě¤ ěëŁ
ęłźě ě ëł´ ë°ę¸°
íěŹëĄ ě§ëś
ě´ ęłźě ě ëšěŠě ě§ëśí기 ěí´ íěŹëĽź ěí ě˛ęľŹě뼟 ěě˛íě¸ě.
ě˛ęľŹěëĄ ę˛°ě ę˛˝ë Ľ ě¸ěŚě íë
