Advanced Certificate in Semiconductor Device Design and Fabrication
-- ViewingNowThe Advanced Certificate in Semiconductor Device Design and Fabrication is a comprehensive course that provides learners with in-depth knowledge and skills in the design and fabrication of semiconductor devices. This course is critical for individuals seeking to advance their careers in the semiconductor industry, where the demand for skilled professionals is high.
7,138+
Students enrolled
GBP £ 140
GBP £ 202
Save 44% with our special offer
ě´ ęłźě ě ëí´
100% ě¨ëźě¸
ě´ëěë íěľ
ęłľě ę°ëĽí ě¸ěŚě
LinkedIn íëĄíě ěśę°
ěëŁęšě§ 2ę°ě
죟 2-3ěę°
ě¸ě ë ěě
ë기 ę¸°ę° ěě
ęłźě ě¸ëśěŹí
⢠Semiconductor Material Science: This unit covers the fundamental properties and behavior of semiconductor materials, including their electrical and optical characteristics.
⢠Semiconductor Device Physics: This unit delves into the physics of semiconductor devices, including p-n junctions, metal-oxide-semiconductor (MOS) capacitors, and bipolar transistors.
⢠Semiconductor Device Design: This unit covers the design process for semiconductor devices, including device modeling, simulation, and optimization.
⢠Semiconductor Fabrication Processes: This unit explores the various fabrication processes used to create semiconductor devices, including photolithography, etching, deposition, and doping.
⢠Semiconductor Device Testing and Reliability: This unit covers the testing and reliability assessment of semiconductor devices, including electrical testing, reliability analysis, and failure mechanisms.
⢠Semiconductor Process Integration: This unit covers the integration of various semiconductor processes to create complex semiconductor devices, including front-end-of-line (FEOL) and back-end-of-line (BEOL) processes.
⢠Semiconductor Device Packaging: This unit explores the various packaging technologies used to protect and interconnect semiconductor devices, including wire bonding, flip-chip, and 3D integration.
⢠Advanced Semiconductor Devices: This unit covers advanced semiconductor devices, including power devices, RF devices, and MEMS devices.
⢠Semiconductor Design Automation: This unit covers the use of automation tools in semiconductor design, including electronic design automation (EDA) software, verification tools, and layout tools.
ę˛˝ë Ľ 경ëĄ
ě í ěęą´
- 죟ě ě ëí 기본 ě´í´
- ěě´ ě¸ě´ ëĽěë
- ěť´í¨í° ë° ě¸í°ëˇ ě ꡟ
- 기본 ěť´í¨í° 기ě
- ęłźě ěëŁě ëí íě
ěŹě ęłľě ěę˛Šě´ íěíě§ ěěľëë¤. ě ꡟěąě ěí´ ě¤ęłë ęłźě .
ęłźě ěí
ě´ ęłźě ě ę˛˝ë Ľ ę°ë°ě ěí ě¤ěŠě ě¸ ě§ěęłź 기ě ě ě ęłľíŠëë¤. ꡸ę˛ě:
- ě¸ě ë°ě 기ę´ě ěí´ ě¸ěŚëě§ ěě
- ęśíě´ ěë 기ę´ě ěí´ ęˇě ëě§ ěě
- ęłľě ě겊ě ëł´ěě
ęłźě ě ěąęłľě ěźëĄ ěëŁí늴 ěëŁ ě¸ěŚě뼟 ë°ę˛ ëŠëë¤.
ě ěŹëë¤ě´ ę˛˝ë Ľě ěí´ ě°ëŚŹëĽź ě ííëę°
댏롰 ëĄëŠ ě¤...
ě죟 돝ë ě§ëʏ
ě˝ě¤ ěę°ëŁ
- 죟 3-4ěę°
- 쥰기 ě¸ěŚě ë°°ěĄ
- ę°ë°Ší ëąëĄ - ě¸ě ë ě§ ěě
- 죟 2-3ěę°
- ě 기 ě¸ěŚě ë°°ěĄ
- ę°ë°Ší ëąëĄ - ě¸ě ë ě§ ěě
- ě 체 ě˝ě¤ ě ꡟ
- ëě§í¸ ě¸ěŚě
- ě˝ě¤ ěëŁ
ęłźě ě ëł´ ë°ę¸°
íěŹëĄ ě§ëś
ě´ ęłźě ě ëšěŠě ě§ëśí기 ěí´ íěŹëĽź ěí ě˛ęľŹě뼟 ěě˛íě¸ě.
ě˛ęľŹěëĄ ę˛°ě ę˛˝ë Ľ ě¸ěŚě íë