Professional Certificate in Semiconductor Packaging for High-Frequency Applications
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• Fundamentals of Semiconductor Packaging: An introduction to semiconductor packaging, materials, and processes. • High-Frequency Circuit Design: Exploration of high-frequency circuit design principles and considerations. • Semiconductor Packaging Technologies: Examination of various semiconductor packaging technologies and their applications. • High-Frequency Materials and Properties: Analysis of high-frequency materials and their properties. • Package Design for High-Speed Channels: Study of package design considerations for high-speed channels. • Signal Integrity and Power Integrity: Understanding of signal integrity and power integrity concepts in semiconductor packaging. • Testing and Validation of High-Frequency Packages: Exploration of testing and validation techniques for high-frequency semiconductor packages. • Advanced Semiconductor Packaging Technologies: Examination of advanced semiconductor packaging technologies and their applications in high-frequency applications.
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- BasicUnderstandingSubject
- ProficiencyEnglish
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- ThreeFourHoursPerWeek
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