Advanced Certificate in Semiconductor Wafer Level Packaging
-- ViewingNowThe Advanced Certificate in Semiconductor Wafer Level Packaging is a comprehensive course designed to equip learners with the essential skills needed to excel in the semiconductor industry. This course covers advanced topics such as 3D integration, fan-out wafer-level packaging, and advanced interconnect technologies, providing a deep understanding of the latest trends and developments in the field.
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โข Semiconductor Wafer Level Packaging Fundamentals
โข Wafer Thinning and Backgrinding Technologies
โข Advanced Wafer Level Packaging Design and Simulation
โข Wafer Level Packaging Materials and Reliability
โข Fan-out Wafer Level Packaging (FOWLP) Technology
โข 3D Wafer Level Packaging: Concepts and Applications
โข Wafer Level Packaging Process Integration and Control
โข Advanced Interconnect and Bonding Techniques
โข Semiconductor Wafer Level Packaging Inspection and Testing
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- BasicUnderstandingSubject
- ProficiencyEnglish
- ComputerInternetAccess
- BasicComputerSkills
- DedicationCompleteCourse
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- ThreeFourHoursPerWeek
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